DRIE or the deep reactive-ion etching is the process in fabrication where parts from silicon wafers are being created. The part shapes of the silicon wafer are being outlined through a process called lithography. Through lithography, a mask very similar to the silicon wafer is made and further plasma etched. This process was not originally intended for watch-making but was then applied because of its precision as well as the quality of the silicon’s properties. It is originally developed for MEMS devices such as the accelerometer for smart phones.
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